Huawei’s Ambitious Laptop Runs on Older Tech

Kirin X90 chip

Huawei has officially unveiled its latest foldable laptop, the MateBook Fold, but beneath its sleek, modern design lies older-generation technology. According to a report released Monday by Canadian research firm TechInsights, the MateBook Fold is powered by a 7nm Kirin X90 chip produced by China’s Semiconductor Manufacturing International Corp (SMIC). The findings offer a telling snapshot of how U.S. export controls continue to block China’s top foundry from advancing into cutting-edge semiconductor production.

Industry watchers had speculated that Huawei might debut SMIC’s next-gen 5nm-equivalent N+3 process chip in this device — a significant leap that would mark Huawei’s boldest step yet in full-stack computing, integrating in-house chip design, operating system development, and hardware engineering. However, TechInsights’ teardown revealed otherwise: the foldable laptop relies on the same 7nm N+2 process chip SMIC first introduced in August 2023.

U.S. Curbs Stall China’s Semiconductor Progress

The decision — or necessity — to use the older chip underlines an important reality. According to TechInsights, SMIC has likely not yet succeeded in developing a reliable, scalable 5nm-equivalent chip node. The report attributes much of this to persistent U.S.-imposed technology restrictions, which have limited SMIC’s access to critical advanced chipmaking equipment like extreme ultraviolet (EUV) lithography machines.

Without EUV, Chinese foundries like SMIC must rely on multi-patterning techniques — a less efficient and more costly process that typically results in lower yields and higher production challenges. This has left SMIC trailing behind semiconductor leaders such as TSMC, Intel, and Samsung, all of which are actively preparing for 2nm process technology rollouts within the next 12 to 24 months.

Even with the workaround, Huawei’s 7nm chips remain several generations behind those found in devices from industry giants like Apple, Qualcomm, and AMD. The limitations extend beyond smartphones and PCs, affecting Huawei’s ambitions in cloud computing and AI infrastructure as well.

A New Ecosystem Push — Without U.S. Chips

The MateBook Fold is part of Huawei’s strategic pivot toward ecosystem independence. The device, which features an 18-inch OLED dual-screen display and no physical keyboard, ships with the company’s HarmonyOS operating system. Notably, Huawei did not disclose the exact processor specifications in its product announcement — a likely response to geopolitical sensitivities and competitive scrutiny.

Until recently, Huawei’s laptops predominantly featured Intel processors. But following the U.S. Commerce Department’s decision last year to revoke chip export licenses held by Intel and Qualcomm for Huawei devices, the tech giant was left scrambling for alternatives. The MateBook Fold represents one of Huawei’s first consumer laptops built entirely around China-sourced hardware and software solutions.

Interesting Footnote: Huawei Claims to Be Catching Up

Despite the technological gap, Huawei’s leadership continues to project optimism. In a recent interview with Chinese state media, Huawei founder and CEO Ren Zhengfei insisted that the company’s chips are now just one generation behind U.S. rivals. Ren highlighted Huawei’s focus on leveraging cluster computing and innovative system-level optimizations to enhance performance in the absence of cutting-edge fabrication processes.

While Ren’s confidence suggests an unbroken drive within Huawei to narrow the semiconductor divide, most industry analysts remain skeptical. With global chip leaders racing toward 2nm production, and China’s foundries still wrestling with 7nm scalability, the road ahead for Huawei — and for China’s chip ambitions at large — remains steep and uncertain.

Extra Insight: TSMC’s 2nm Factory Update

In related industry news, Taiwan’s TSMC confirmed this month that its first 2nm chip factory in Hsinchu is on track for mass production by late 2025. This development further underscores the widening technology gap Huawei and SMIC must navigate if they hope to stay competitive on the global semiconductor stage.


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